Canteliver Probe Card
MPI Cantilever Probe Card is widely utilized on gold bump and pad wafer testing for Show driver, logic, and memory product. MPI’s cantilever probes tend to be the corresponding answer for the calls for of fine pitch, smaller pad sizing, higher speed, fewer cleansing, multi-DUT, high pin count, and ultra-reduced leakage needs. With fantastic craftsmanship, ground breaking architecture and proven methodologies according to mechanical and electrical simulation/measurement final results, producing MPI the very best cantilever supplier around the world.
FCB Probe Card
The FCB Probe Card is considered the most mature engineering of buckling beam probe card. It really is aimed to realize the semiconductor ship manufacture time-to-industry (TTM) and value of check (COT) demand. FCB is a tested Alternative for several different semiconductor generation assessments from early engineering pilot-runs to higher quantity production (HVM). FCB is ready for device demanding substantial signal integrity probing (SI) and/or power integrity probing (PI). Purposes incorporate reducing-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and much more. FCB assures the globe’s greatest overall Charge-of-ownership (COO) for various DUT apps.
EVS Probe Card
The EVS Probe Card is surely an improvement in excess of the conventional buckling beam probe card. Critical capabilities are better recent carrying ability (C.C.C.) and decrease balanced Call power (BCF), in addition to All round MEMS-like features. EVS can easily meet up with the need of Innovative wafer probing. Specific alignment and outstanding planarity Regulate would be the vital aspects contributing to secure contact resistance. With its capability and general performance, EVS Probe Card is a great option for advanced probe EVS Probe Card cards.
Osprey probe card
The Osprey probe card is MPI’s Resolution to demand for ever finer pitch. It truly is suitable for smaller Al pad, and it is ideal for little pitch software with peripheral and whole array pattern. With precise alignment and greater planarity Regulate, Osprey can reach greater productiveness by multi-DUT layout. The forming wire (FW) form needle produced with MPI’s personal micro fabrication method not merely provides substantial-excellent general performance but also allows uncomplicated needle replacement and shortens sustaining cycle time.
Kestrel Probe Card
The Kestrel Probe Card is equipped with MEMS wire (MW) needle that is designed for the demand of low force probing. It also comes along with a chance to fulfill higher C.C.C. and higher pin counts software. The MEMS approach makes sure really consistent needle characteristics, and also the Unique composition structure permits precise alignment and planarity Regulate.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.
https://www.mpi-corporation.com/probecard/